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Resonation
Structure
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Our previous attempts have been
focused on using laser-micromachining to fabricate the copper
spring. Laser micromachining is direct and fast, but the
cutting resolution may be improved further. We are now
developing another process which involves
high-aspect-ration electroplating of copper using lithographic
techniques. First of all, a seed layer is sputtered on the
silicon wafer. Then, a SU-8 photoresist is coated and baked to
form the desired thickness of spring. After that, the SU-8
photoresist is exposed to transfer the desired pattern from
the mask to SU-8. The mold for the resonating spring can then
be formed after developing the SU-8 photoresist. Then, copper
is electroplated on the mold. Finally, the SU-8 photoresist
and seed layer are stripped and the desired dimension of
copper spring can be obtained. The mold of the resonating
spring after the development of SU-8 is shown below.


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